3M proprietary blend of inorganic fillers contained in a non-silicone organic matrix helps ensure high thermal conductivity and low thermal resistance. Ideal for applications that require rework ability, thin bond lines, and complete wet-out to provide the most effective heat dissipation.
3M™ Thermally Conductive Grease provides high performance thermal energy transfer from a heat source (processor chip, graphics, chip, high power LED) to a heat sink.
Greases can be screen printed and combined with other thermal products and bonding solutions to meet your complete thermal management requirements.
> High Performance thermal interface material
> Good bulk conductivity
> Excellent thermal impedance
> < 40 μ max particle diameter
> Screen printable
> Non-silicone material
> Thin interface to offer low thermal resistance
> Good wet-out